About to SEEM 2025
The International Conference on Software Engineering and Electronic Materials 2025 (SEEM 2025) is about to be grandly held in the picturesque city of Lijiang. It will be a technology event that gathers top scientists, engineers, scholars, and industry experts from around the world. The purpose of this conference is to explore the latest developments and cross applications in the fields of software engineering and electronic materials, providing participants with a high-end communication platform to showcase cutting-edge research results, share practical experience and technological breakthroughs. Lijiang, with its unique natural beauty and rich cultural heritage, adds a unique charm to this academic event. SEEM 2025 will focus on the theme of "Integrated Innovation, Intelligent Creation for the Future", with a particular emphasis on discussing hot topics such as the design and preparation of advanced electronic materials, Software Defined Networking (SDN), embedded system development, and software applications in intelligent manufacturing. The conference promotes interdisciplinary knowledge exchange and cooperation, and drives technological innovation and development through a series of keynote speeches, thematic seminars, and interactive sessions. This conference not only focuses on theoretical research, but also emphasizes practical applications, aiming to explore how to transform the latest scientific research achievements into productivity and solve complex problems in the real world. Attendees not only have the opportunity to learn about the latest technological developments, but also have the chance to participate in in-depth discussions and explore future development directions together. We look forward to inspiring more innovative ideas, strengthening international cooperation, and injecting new vitality and possibilities into the development of software engineering and electronic materials in the context of Lijiang, a beautiful city, through SEEM 2025. Welcome professionals from all over the world to gather together and embark on this feast of knowledge and wisdom.
Record
All full paper submissions to the SEEM 2025 could be written in English and will be sent to at least two reviewers and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability. All accepted papers of SEEM 2025 will be published in the conference proceedings, which will be submitted to EI Compendex, Scopus for indexing.
Submission Portal
Mail Address: seem@sub-paper.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists;
- 李老师
- TEL：18581520396 (微信同号)
- QQ：3959598883
- E-mail：seem@sub-paper.com
Important Dates
Submission Deadline：2025-05-16
Registration Deadline：2025-05-23
Conference Date：2025-06-02
Notification Date：About a week after the submission
CALL FOR PAPERS
Software Engineering: automatic control software maintenance Requirement Engineering software reuse Software management model engineering software architecture design Artificial Intelligence and Recognition Reconstruction and Reverse Engineering Embedded Software and Applications Programming Languages and Software Engineering Model driven architecture and engineering Electronic materials: dielectrics magnetic material Optoelectronic materials integrated circuit Piezoelectric and ferroelectric materials High performance semiconductor materials Wireless Sensor Network Materials Photon materials for optoelectronic devices
..... View more themes>>About Plagiarism Check
Crosscheck Powered by iThenticate will be used for plagiarism check. The amount of duplication from previously published content should be less than 20%; If the amount of duplication is 20% - 35%, modification maybe required; if the amount of duplication exceeds 35%, the article will be rejected. Please note that there will be no refund for no-shows.
Indexing Service
中文特别声明
出版社在论文出版前会对论文重复率进行检测，重复率大于20%的稿件将被拒绝出版；重复率不大于20%的稿件中，如有整段大面积的直接复制其他作者文章内容的情况，也会被拒绝出版。以上两种涉及抄袭的情况，一旦被出版社证实，文章将被拒绝出版，并且不退回任何会议注册费用。
Technical Sponsor
Submission Guidelines
Submit
Please submit the full text/abstract
of the paper to us through the elec
tronic submission system
Call for Reviewers
As a platform for global academic communication, the quality of conference publication has always an aspect attracting much of our attention. To ensure quality of our publication and to better serve the peers in academic circle, we now call for reviewers among professionals and experts of the world. Professionals and experts who hold PhD (doctoral) degree in the conference related areas are encouraged to join in us and together, we will work hard to become a world-class academic conference. Please send us your CV by email (seem@sub-paper.com) if you are interested in it.
SCI JOURNAL
Contributors are encouraged to submit papers / abstracts to the conference. The organizing committee will select high-quality papers and recommend them to SCI/SSCI journals. For specific matters, please contact the person in charge of the conferrence.
Submission Guidelines
Delegates are encouraged to submit their papers/abstracts to the conference. Good quality papers will be selected by the organizing committee and Prof. Soteris Kalogirou, the editor in chief. After it, the authors will be invited to extent their papers/abstracts and submit them to seem@sub-paper.com. The normal size of research papers is 4,000-6,000 words excluding abstract and references.