2025 International Conference on Software Engineering and Electronic Materials

ORGANIZING COMMITTEES

Conference Committee

M.A. Jabbar, IEEE Senior Member, Vardhman College of Engineering, Inida Prof. Fakhri Karray, University of Waterloo, Canada IEEE Fellow, Fellow of the Canadian Academy of Engineering Assoc. Prof. Hicham Chaoui, Carleton University, Canada IEEE Senior Member Prof. Howard Li, University of New Brunswick, Canada IEEE Senior Member Prof. Daniele Giusto University of Cagliari, Italy IEEE Senior Member Prof. Witold Pedrycz University of Alberta, Canada IEEE Fellow

Program Committee

Assoc. Prof. Hosam El-Ocla IEEE Senior Member Lakehead University, USA Prof. Giampiero Chiaselotti, University of Calabria, Italy Assoc. Prof. Bhilai Institute of Technology Raipur, India Assoc. Prof. Claudio Gallicchio, University of Pisa, Italy Asst. Prof. Thakerng Wongsirichot, Prince of Songkla University, Thailand Dr. Goh Yeh Huann, Tunku Abdul Rahman University College, Malaysia

International Technical Committee

Dr. Ayush Dogra Panjab University, India Prof. Giampiero Chiaselotti, University of Calabria, Italy Dr. Yasmina Belaroussi, Center for Development of Advanced Technologies, Algeria Dr. Sachin Kumar, SRM Institute of Science and Technology, India Dr. Koh You Beng, University of Malaya, Malaysia

Submission Portal

Mail Address: seem@sub-paper.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists;

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Important Dates

Submission Deadline:2025-05-16
Registration Deadline:2025-05-23
Conference Date:2025-06-02
Notification Date:About a week after the submission

Indexing Service

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