2025 International Conference on Software Engineering and Electronic Materials

Scopes

Software Engineering: automatic control software maintenance Requirement Engineering software reuse Software management model engineering software architecture design Artificial Intelligence and Recognition Reconstruction and Reverse Engineering Embedded Software and Applications Programming Languages and Software Engineering Model driven architecture and engineering Electronic materials: dielectrics magnetic material Optoelectronic materials integrated circuit Piezoelectric and ferroelectric materials High performance semiconductor materials Wireless Sensor Network Materials Photon materials for optoelectronic devices

Submission Portal

Mail Address: seem@sub-paper.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists;

  • 李老师
  • TEL:18581520396 (微信同号)
  • QQ:3959598883
  • E-mail:seem@sub-paper.com

Important Dates

Submission Deadline:2025-05-16
Registration Deadline:2025-05-23
Conference Date:2025-06-02
Notification Date:About a week after the submission

Indexing Service

Technical Sponsor