2025 International Conference on Software Engineering and Electronic Materials

VENUE

Lijiang · China

Submission Portal

Mail Address: seem@sub-paper.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists;

  • 李老师
  • TEL:18581520396 (微信同号)
  • QQ:3959598883
  • E-mail:seem@sub-paper.com

Important Dates

Submission Deadline:2025-05-16
Registration Deadline:2025-05-23
Conference Date:2025-06-02
Notification Date:About a week after the submission

Indexing Service

Technical Sponsor